As LED displays become increasingly widely used, demand for quality, display effect, and performance is growing. Traditional SMD packaging technology no longer meets the demand for high performance and high display quality. Therefore, the emergence of COB and GOB technologies offers solutions for indoor and outdoor LED displays that are more durable and offer better effect quality.
COB LED Display Technology
Concept: COB packaging stands for “chip-on-board.” It is a packaging technology that fixes the LED light-emitting chip (red/green/blue) on the PCB board and then glues the whole thing. Currently, COB packaging is primarily used in fine pitch led screen.
- Main Features
- Better display quality. The COB screen’s luminous surface is a single plane, eliminating graininess and providing a more detailed and uniform image. And the image is pure and smooth, making it extremely comfortable to watch from close range.
- Strong anti-collision and pressure resistance. The COB LED display directly encapsulates the LED chip on the PCB board, and then uses epoxy resin to seal and cure. The surface of the light point is raised into a smooth and hard surface, which is resistant to collision and wear.
- Strong heat dissipation capability. The LED chip is in direct contact with the PCB board, and transferring heat from the LED core directly through the PCB board. This effectively improves heat dissipation efficiency. Furthermore, our special PCB board copper foil manufacturing process virtually eliminates significant light attenuation. As a result, lamp failure is rare, significantly extending the life of the LED.
- Wear-resistant and easy to clean. The surface of the light point is smooth and hard, resistant to collision and wear. And there is no mask, so you can clean dust with water or cloth.
GOB LED Display Technology
Concept: GOB packaging stands for “Glue on Board.” It involves applying a special optical adhesive to the surface-mounted display module for protection. Second, SMD (Surface Mounted Devices) here refers to LED chips packaged as individual surface-mounted LEDs. Use a surface mount machine to mount LED chips onto a PCB board to create LED modules. Therefore, GOB packaging technology is an improved process of SMD technology.
- Main Features
- Highly protective. Under harsh conditions, led lamp failure is likely to occur. Long-distance transportation and accidental collisions can easily cause lamp beads to fall off. So after being packaged with GOB technology, it can effectively prevent collisions, water, moisture, and dust.
- Wide viewing angle: By transforming granular pixels into a flat light panel, the LED screen achieves a shift from a point light source to a surface light source. This results in a more uniform light output, a clearer and more transparent display, and significantly improved viewing angles.
- Improved image quality: The colloid fills the gaps between the lamp beads, effectively reducing the graininess.At the same time,the picture is clearer and the contrast and color are more uniform.
- Easy maintenance: The modular design supports single lamp maintenance, which effectively improves the convenience of maintenance.
COB GOB LED display application
- Retail advertising: Ningshine GOB display has high protection and high cost-effectiveness, so it is very suitable for retail stores, shopping malls and digital billboards.
- Control center/broadcast room/command center: Fine-pitch COB screen has high definition, clear picture quality and high stability.
- For high-traffic/transportation hub scenarios, Ningshine’s LED panels are easy to maintain and scratch-resistant, effectively providing real and reliable display information.
- Rental LED screens often require frequent transportation, assembly and disassembly. GOB technology has impact resistance and is very suitable for rental and stage use.
In conclusion, as an LED display manufacturer, Ningshine will continue to utilize COB and GOB technologies to create high-performance, high-refresh, and high-quality LED screens. Besides, we are committed to using innovative packaging technologies to create visual solutions with smoother image quality, more realistic colors, and more stable operation.